Features:
Koocu Multi-Purpose BGA Reballing Stencil 0.3/0.35/0.4/0.5/Parallel/45 Degrees Hole 0.12MM Direct Heat Template Solder Rework Net
Features : -- Adopt steel material , can be heated directly by the hot air gun -- Easy and quickly for reballing the BGA IC
Koocu Multi-Purpose BGA Reballing Stencil
Hole Size: 0.3/0.35/0.4/0.5/Parallel/45 Degrees Hole 0.12MM Direct Heat Template Solder Rework Net
Features : -- Adopt steel material , can be heated directly by the hot air gun -- Easy and quickly for reballing the BGA IC
Description:
Introducing the Mechanic MC-UFO Universal Reballing Stencil Direct Heat Template for Mobile Phone Repair. This versatile stencil features multiple hole sizes and angles, making it suitable for various BGA IC reballing tasks. Crafted with precision, it ensures accurate and efficient reballing, essential for mobile phone repair. Ideal for professionals and DIY enthusiasts, this stencil is a valuable addition to any repair toolkit.




